The silver-plated TP-107 Series loop-profile SMT test points offer positive and secure locations for most commercially available spring-loaded test clips and probes while providing a strong bond to the surface mount PCB to accommodate for mechanical stress.

The TP-107 Series achieves this through the Helicoil configuration of its flat wire design, resulting in a mounting surface footprint almost double the area of surface adhesion beyond the dimensions of the wire loop material. This bond to the board requires an average 18 lbs. of force to dislodge the test point from the solder pad.